Failure Analytics
Pattern detection, trend analysis, and failure mode insights
Overview
Failure Timeline
Category Distribution
Top Failing Boards
Severity Distribution
Category Breakdown
Detected Failure Patterns
Capacitor ESR Degradation — PowerCtrl-X7 Batch 2024-11
Component Degradation
47
occurrences
$3,995.00
cost impact
NPU Thermal Issues — EdgeAI-T1
Thermal
38
occurrences
$18,430.00
cost impact
Cold Solder Joints — CommLink-5G RF Module
Manufacturing Defect
31
occurrences
$6,510.00
cost impact
Voltage Regulator Overheating — PowerCtrl-X7
Thermal
23
occurrences
$4,140.00
cost impact
Connector Intermittents — PSU-Industrial
Mechanical
22
occurrences
$1,584.00
cost impact
ESD Damage — SensorHub-M3 I2C Interface
ESD
18
occurrences
$1,098.00
cost impact
MOSFET Degradation — MotorDrv-H8 High-Ambient
Component Degradation
15
occurrences
$2,340.00
cost impact
FPGA Configuration Corruption — DisplayCtrl-4K
Firmware/Software
12
occurrences
$4,080.00
cost impact
AI-Generated Insights
BGA Soldering Failures Up 23%
BGA soldering failures on CommLink-5G increased 23% this quarter compared to Q3. Thermal profile adjustments recommended.
Capacitor Batch Anomaly Detected
Batch BAT-PCX7-2024-11 shows 3x baseline capacitor ESR failures. Supplier quality review triggered automatically.
Predictive: EdgeAI-T1 Thermal Risk
ML model predicts 40% probability of thermal failures reaching critical threshold within 30 days without process intervention.
ESD Failures Declining
After ECN-2025-018 TVS diode retrofit, SensorHub-M3 ESD failures decreased 62%. Pattern trending toward resolution.